SMT/SMD PCB Assembly Services

The assembly begins with a delicate phase: the inspection and preparation of electronic components. The materials are stored in protected environments with controlled temperature and humidity, to prevent damage due to unfavorable environmental conditions. Each component is carefully checked to ensure integrity and compatibility with the project specifications. This attention to the quality of materials is essential to ensure the success of the assembly and the durability of the electronic boards.

The components are placed on the printed circuits using state-of-the-art SMT machinery. These devices offer micrometric precision and can easily handle both low-density projects and complex circuits with a high number of components. The automated process ensures uniformity, speed, and minimizes errors, ensuring excellent results even for large production volumes.

After placement, the electronic boards undergo a reflow soldering process in thermally controlled ovens. Inside the ovens, the solder paste melts evenly to create electrical and mechanical connections of the highest quality. At Systel Elettronica, the process is designed to ensure that each joint is stable, durable, and able to withstand mechanical or thermal stresses during the operation of the device.

Each electronic board assembled using the SMT method (Surface Mount Technology) undergoes rigorous functional testing to ensure it meets the required technical specifications and operates correctly. This phase ensures the integrity of the circuit and its performance, guaranteeing that the product is free of defects and fully ready for integration into final devices. The thorough tests we conduct at Systel Elettronica are designed to provide reliability for every electronic system.